| TPC-B520-D50A | TPC-B520-D70A | ||
| Environment | Operating Temperature | -10~60 °C (14~140 °F) | -20~60 °C (-4~140 °F) |
| Environment | Storage Temperature | -30~70 °C (-22~158 °F) | -30~70 °C (-22~158 °F) |
| Environment | Vibration Protection | 1 Grms, random | 1 Grms, random |
| Environment | Shock Protection | 10 G, half sine | 10 G, half sine |
| Hardware | Certification | CB/UL, CE, FCC Class A, CCC, BIS, BSMI, RoHS | CB/UL, CE, FCC Class A, CCC, BIS, BSMI, RoHS |
| Hardware | CPU | Intel® Core™ i5-1335UE 1.3GHz 10-Core | Intel® Core™ i7-1365UE 1.7GHz 10-Core |
| Hardware | Hardware Security | TPM 2.0 | TPM 2.0 |
| Hardware | I/O | 2 x RS-232/422/485, 2 x USB 3.1, 2 x USB 2.0, 1 x Type C, 1 x DP, 1 x iDoor Slot | 2 x RS-232/422/485, 2 x USB 3.1, 2 x USB 2.0, 1 x Type C, 1 x DP, 1 x iDoor Slot |
| Hardware | LAN | 2 x 2500 Mbps | 2 x 2500 Mbps |
| Hardware | Storage | 1 x M.2 B key, 1 x 2.5" SSD/HDD Bay | 1 x M.2 B key, 1 x 2.5" SSD/HDD Bay |
| Hardware | Expansion | 1 x M.2 E Key 2230 | 1 x M.2 E Key 2230 |
| I/O Interface | Expansion | 1 x M.2 B key, 1 x M.2 E key | 1 x M.2 B key, 1 x M.2 E key |
| Expansion Function | SIM card slot | Nano SIM card | Nano SIM card |
| I/O Interface | Displays | 1 x DP | 1 x DP |
| I/O Interface | Power Connector | 1 x 3-Pin Terminal Block | 1 x 3-Pin Terminal Block |
| Mechanical | Mounting | Panel, Wall, Stand, VESA | Panel, Wall, Stand, VESA |
| Mechanical | Weight (Net) | 2.8 kg (6.17 lb) | 2.8 kg (6.17 lb) |
Advantech TPC-B520 Modular TPC - Computing Box Module with Intel® Core™ processors (13th gen)
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